Bukat, K.: search on Z-Library

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1

Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper

Bukat, K., Kościelski, M., Sitek, J., Jakubowska, M., Młożniak, A.

Journal:

Soldering & Surface Mount Technology

Year:

2011

Language:

english

File:

PDF, 838 KB

english, 2011

2

SAC 305 solder paste with carbon nanotubes – part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties

Bukat, K., Sitek, J., Kościelski, M., Jakubowska, M., Słoma, M., Młożniak, A., Niedźwiedź, W.

Journal:

Soldering & Surface Mount Technology

Year:

2012

Language:

english

File:

PDF, 698 KB

english, 2012

3

SAC solder paste with carbon nanotubes. Part II: carbon nanotubes’ effect on solder joints’ mechanical properties and microstructure

Bukat, Krystyna, Sitek, Janusz, Koscielski, Marek, Niedzwiedz, Wojciech, Mlozniak, Anna, Jakubowska, Malgorzata

Journal:

Soldering & Surface Mount Technology

Year:

2013

Language:

english

File:

PDF, 688 KB

english, 2013

4

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Comparisons of nano-additives influence on properties of the bi-modal solder pastes for special applications

Sitek, Janusz, Zhang, Yan, Ma, Shiwei, Liu, Johan, Ga, Yulai, Zha, Qijie, Koscielski, Marek, Bukat, Krystyna, Arazna, Aneta, Jakubowska, Malgorzata, Mlozniak, A.

Year:

2011

Language:

english

File:

PDF, 3.84 MB

english, 2011

5

Investigation of the wetting of PCBs with SnCu (HASL) and Snimm finishes by SnZnBiIn solders

Bukat, Krystyna, Sitek, Janusz, Koscielski, Marek, Moser, Zbigniew, Gasior, Wladyslaw, Pstrus, Janusz

Journal:

Soldering & Surface Mount Technology

Year:

2012

Language:

english

File:

PDF, 401 KB

english, 2012

6

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Investigation of properties of the SAC solder paste with the silver nanoparticle and carbon nanotube additives and the nano solder joints

Jakubowska, Malgorzata, Bukat, Krystyna, Koscielski, Marek, Mlozniak, Anna, Niedzwiedz, Wojciech, Sloma, Marcin, Sitek, Janusz

Year:

2010

Language:

english

File:

PDF, 1.87 MB

english, 2010

7

Thermophysical properties and wetting behavior on Cu of selected SAC alloys

Fima, Przemyslaw, Gancarz, Tomasz, Pstrus, Janusz, Bukat, Krystyna, Sitek, Janusz

Journal:

Soldering & Surface Mount Technology

Year:

2012

Language:

english

File:

PDF, 268 KB

english, 2012

8

[IEEE 2012 35th International Spring Seminar on Electronics Technology (ISSE) - Bad Aussee, Austria (2012.05.9-2012.05.13)] 2012 35th International Spring Seminar on Electronics Technology - Sac 305 solder paste with silver nanopowder and carbon nanotubes addition - basic properties of pastes and solder joints

Koscielski, Marek, Bukat, Krystyna, Sitek, Janusz, Jakubowska, Malgorzata, Niedźwiedź, Wojciech, Mlozniak, Anna

Year:

2012

Language:

english

File:

PDF, 1.68 MB

english, 2012

9

Evaluation of the influence of Bi and Sb additions to Sn‐Ag‐Cu and Sn‐Zn alloys on their surface tension and wetting properties using analysis of variance – ANOVA

Bukat, K., Sitek, J., Kisiel, R., Moser, Z., Gasior, W., Kościelski, M., Pstruś, J.

Journal:

Soldering & Surface Mount Technology

Year:

2008

Language:

english

File:

PDF, 215 KB

english, 2008

10

The Knobe Effect with Probable Outcomes and Availability Heuristic Triggers

Ostillio, Tommaso, Bukat, Michal

Journal:

Logos & Episteme

Year:

2019

File:

PDF, 381 KB

2019

11

A reliability study of the lead-free solder connections of miniature chip components on hybrid circuits

D. Ročak, S. Maček, J. Sitek, M. Hrovat, K. Bukat, Z. Drozd

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.35 MB

english, 2007

12

Investigation of Sn‐Zn‐Bi solders – Part I: surface tension, interfacial tension and density measurements of SnZn7Bi solders

Bukat, K., Moser, Z., Sitek, J., Gąsior, W., Kościelski, M., Pstruś, J.

Journal:

Soldering & Surface Mount Technology

Year:

2010

Language:

english

File:

PDF, 105 KB

english, 2010

13

A comparison of the quality of lead‐free solder pastes

Sitek, Janusz, Ročak, Dubravka, Bukat, Krystyna, Fajfar‐Plut, Janeta, Belavič, Darko

Journal:

Soldering & Surface Mount Technology

Year:

2004

Language:

english

File:

PDF, 630 KB

english, 2004

14

Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders

Moser, Z., Fima, P., Bukat, K., Sitek, J., Pstruś, J., Gąsior, W., Kościelski, M., Gancarz, T.

Journal:

Soldering & Surface Mount Technology

Year:

2011

Language:

english

File:

PDF, 285 KB

english, 2011

15

[IEEE 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Tratanska Lomnica, Slovakia (2011.05.11-2011.05.15)] Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Properties of the SAC solder paste with different nanoparticles

Bukat, Krystyna, Koscielski, Marek, Sitek, Janusz, Jakubowska, Malgorzata, Mlozniak, Anna

Year:

2011

Language:

english

File:

PDF, 2.27 MB

english, 2011

16

Investigation of Sn‐Zn‐Bi solders – Part II: wetting measurements on Sn‐Zn7Bi solders on copper and on PCBs with lead‐free finishes by means of the wetting balance method

Bukat, K., Sitek, J., Kościelski, M., Moser, Z., Gąsior, W., Pstruś, J.

Journal:

Soldering & Surface Mount Technology

Year:

2010

Language:

english

File:

PDF, 240 KB

english, 2010

17

[IEEE 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. - Wiener Neustadt, Austria (May 19-20, 2005)] 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. - Influence of flux activity on process parameters and solder joints in lead-free wave soldering

Sitek, J., Bukat, K.

Year:

2005

Language:

english

File:

PDF, 937 KB

english, 2005

18

The properties of soldering mask hardened by means of UV using acrylate and methacrylate oligomers

Tadeusz Matynia, Romualda Kutyłkea, Krystyna Bukat, Barbara Pieńkowska

Journal:

Journal of Applied Polymer Science

Year:

1995

Language:

english

File:

PDF, 929 KB

english, 1995

19

The effect of type of the inorganic filler and dopant salt concentration on the PEO–LiClO4 based composite electrolyte–lithium electrode interfacial resistivity

A. Bac, M. Ciosek, M. Bukat, M. Marczewski, H. Marczewska, W. Wieczorek

Journal:

Journal of Power Sources

Year:

2006

Language:

english

File:

PDF, 193 KB

english, 2006

20

[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - An Introduction of RoHS Legislation in SMD Thick-Film Hybrid Technology - a Case Study

Belavic, Darko, Rocak, Dubravka, Plut, Janeta, Hrovat, Marko, Pavlic, Janez, Drozd, Zdzislaw, Macek, Srecko, McGill, Ian, Bukat, Krystyna

Year:

2006

Language:

english

File:

PDF, 6.16 MB

english, 2006

21

[IEEE 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials Production, 2003. - High Tatras, Slovakia (2003.05.11-2003.05.11)] 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials Production, 2003. - Influence of the Cu substrate surface energy on lead-free solder paste wetting properties

Sitek, J., Bukat, K., Borecki, J., Ionescu, C.

Year:

2003

Language:

english

File:

PDF, 405 KB

english, 2003

22

[IEEE High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - (2007.06.26-2007.06.28)] High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - Advances in Europe - China Green Electronics Collaboration

Andersen, Otto, Anderssen, Idun Husabo, Liu, Johan, Whalley, David, Kristiansen, Helge, Gronlund, Tom Ove, Bukat, Krystyna, Lu, Xiuzhen

Year:

2007

Language:

english

File:

PDF, 418 KB

english, 2007

23

[IEEE 2007 30th International Spring Seminar on Electronics Technology - Cluj-Napoca, Romania (2007.5.9-2007.5.13)] 2007 30th International Spring Seminar on Electronics Technology (ISSE) - Quality Management in Electronics Manufacturing after Implementation of RoHS Directive

Kisiel, R., Bukat, K., Drozd, Z., Szwech, M., Syryczyk, P., Girulska, A.

Year:

2007

Language:

english

File:

PDF, 937 KB

english, 2007

24

EP-1792: A non-measuring way to compare pre-treatment QA devices and set gamma analysis parameters

Gizynska, M., Blatkiewicz, D., Bukat, M., Gil-Ulkowska, M., Maluszczak, S., Paciorkiewicz, A., Szałkowski, D., Walewska, A.

Journal:

Radiotherapy and Oncology

Year:

2018

Language:

english

File:

PDF, 965 KB

english, 2018

25

Pb-Free solders: Part II. Application of ADAMIS database in modeling of Sn−Ag−Cu alloys with Bi additions

I. Ohnuma, K. Ishida, Z. Moser, S. Gąsior, K. Bukat, J. Pstruś, R. Kisiel, J. Sitek

Journal:

Journal of Phase Equilibria and Diffusion

Year:

2006

Language:

english

File:

PDF, 548 KB

english, 2006

26

(Sn-Ag)eut+Cu soldering materials, part I: Wettability studies

W. Gasior, Z. Moser, J. Pstruś, K. Bukat, J. Sitek, R. Kisiel

Journal:

Journal of Phase Equilibria and Diffusion

Year:

2004

Language:

english

File:

PDF, 219 KB

english, 2004

27

[IEEE 2010 33rd International Spring Seminar on Electronics Technology (ISSE) - Warsaw, Poland (2010.05.12-2010.05.16)] 33rd International Spring Seminar on Electronics Technology, ISSE 2010 - Application of silver nanoparticles to improve wettability of SnAgCu solder paste

Koscielski, Marek, Bukat, Krystyna, Jakubowska, Malgorzata, Mlozniak, Anna

Year:

2010

Language:

english

File:

PDF, 2.97 MB

english, 2010

28

Lifetimes of lowest levels in nuclei La139 and Pm145 and nature of l-forbidden transitions

E.Ye. Berlovich, G.M. Bukat, Yu.K. Gusev, V.V. Il'in, V.V. Nikitin, M.K. Nikitin

Journal:

Physics Letters

Year:

1962

Language:

english

File:

PDF, 324 KB

english, 1962

29

PV-0420: Learn before you measure: Method of single-isolated errors analysis for ArcCheck

Gizynska, M., Bukat, M., Cybowska, J., Filipek, M., Garbacz, M., Scisniak, I., Spyra, A., Szalkowski, D., Walewska, A.

Journal:

Radiotherapy and Oncology

Year:

2017

Language:

english

File:

PDF, 601 KB

english, 2017

30

Phase relations in the system Cu-Eu-O and thermodynamic properties of CuEu2O4and CuEuO2

R. Kisiel, W. Gasior, Z. Moser, J. Pstruś, K. Bukat, J. Sitek

Journal:

Journal of Phase Equilibria and Diffusion

Year:

2004

Language:

english

File:

PDF, 187 KB

english, 2004

31

The effect of salt concentration on the PEO–LiClO4–lithium electrode interfacial resistivity

Artur Bac, Marcin Ciosek, M. Bukat, M. Siekierski, Władysław Wieczorek

Journal:

Journal of Power Sources

Year:

2006

Language:

english

File:

PDF, 137 KB

english, 2006

32

Influence of macromolecular additives on transport properties of lithium organic electrolytes

A. Plewa, F. Chyliński, M. Kalita, M. Bukat, P. Parzuchowski, R. Borkowska, M. Siekierski, G.Z. Żukowska, W. Wieczorek

Journal:

Journal of Power Sources

Year:

2006

Language:

english

File:

PDF, 379 KB

english, 2006

33

The problem of creating an automated system for the combined processing of spectroscopic data

R. G. Zhbankov, V. V. Sivchik, D. K. Buslov, G. M. Bukat, M. A. El'yashevich, A. B. Kovrikov, L. A. Gribov

Journal:

Journal of Applied Spectroscopy

Year:

1973

Language:

english

File:

PDF, 282 KB

english, 1973

34

SPIE Proceedings [SPIE Tenth Symposium on Laser Technology - Szczecin - Świnoujście, Poland (Monday 24 September 2012)] Laser Technology 2012: Applications of Lasers - Low-cost devices for phototherapy of small wounds

Rudziński, Adam, Woliński, Wiesław L., Jankiewicz, Zdzisław, Bukat, Marcin, Łazowski, Jacek, Romaniuk, Ryszard S.

Year:

2012

Language:

english

File:

PDF, 3.18 MB

english, 2012

35

Pb-Free solders: Part 1. Wettability testing of Sn−Ag−Cu alloys with Bi additions

Z. Moser, W. Gąsior, K. Bukat, J. Pstruś, R. Kisiel, J. Sitek, K. Ishida, I. Ohnuma

Journal:

Journal of Phase Equilibria and Diffusion

Year:

2006

Language:

english

File:

PDF, 384 KB

english, 2006

36

Pb-Free Solders: Part III. Wettability Testing of Sn-Ag-Cu-Bi Alloys with Sb Additions

Z. Moser, W. Gasior, K. Bukat, J. Pstruś, R. Kisiel, J. Sitek, K. Ishida, I. Ohnuma

Journal:

Journal of Phase Equilibria and Diffusion

Year:

2007

Language:

english

File:

PDF, 381 KB

english, 2007

37

PO-0911 Choose before you measure. Setting gamma parameters for different QA devices on the basis of ROC.

Giżyńska, M., Blatkiewicz, D., Bukat, M., Gil-Ulkowska, M., Maluszczak, S., Paciorkiewicz, A., Szałkowski, D., Walewska, A.

Journal:

Radiotherapy and Oncology

Year:

2019

Language:

english

File:

PDF, 294 KB

english, 2019

38

Comparison of new no-clean fluxes on PCBs and thick film hybrid circuits

D. Ročak, K. Bukat, M. Zupan, J. Fajfar-Plut, V. Tadić

Journal:

Microelectronics Journal

Year:

1999

Language:

english

File:

PDF, 3.66 MB

english, 1999

39

EP-1784 ArcCheck HU setting influence on the uncertainty of pre-treatment verification results

Giżyńska, M., Bukat, M., Szałkowski, D., Walewska, A.

Journal:

Radiotherapy and Oncology

Year:

2019

Language:

english

File:

PDF, 373 KB

english, 2019

40

[IEEE 2018 International Conference on Information , Communication, Engineering and Technology (ICICET) - Pune, India (2018.8.29-2018.8.31)] 2018 International Conference on Information , Communication, Engineering and Technology (ICICET) - Study of Various Attacks and Routing Protocols in MANETS

Kulkarni, A. N., Bukate, R. R., Nanaware, S. D.

Year:

2018

Language:

english

File:

PDF, 376 KB

english, 2018

41

The competitive interactions between the anion-receptor, anions and neutral solvent species

A. Plewa-Marczewska, M. Bukat, M. Kalita, A. Sołgała, D. Pourjafarinokande, S. Ketabi, H. Emani, A. Piśniak, M. Siekierski

Journal:

Journal of Power Sources

Year:

2009

Language:

english

File:

PDF, 587 KB

english, 2009

42

Effect of calixpyrrole in PEO–LiBF4 polymer electrolytes

M. Kalita, M. Bukat, M. Ciosek, M. Siekierski, S.H. Chung, T. Rodríguez, S.G. Greenbaum, R. Kovarsky, D. Golodnitsky, E. Peled, D. Zane, B. Scrosati, W. Wieczorek

Journal:

Electrochimica Acta

Year:

2005

Language:

english

File:

PDF, 160 KB

english, 2005

43

[IEEE 2008 31st International Spring Seminar on Electronics Technology (ISSE) - Budapest, Hungary (2008.05.7-2008.05.11)] 2008 31st International Spring Seminar on Electronics Technology - Influence of PCBs coatings wettability on lead-free SMT solder joints reliability

Sitek, J., Drozd, Z., Bukat, K.

Year:

2008

Language:

english

File:

PDF, 357 KB

english, 2008

44

[IEEE 2007 30th International Spring Seminar on Electronics Technology - Cluj-Napoca, Romania (2007.5.9-2007.5.13)] 2007 30th International Spring Seminar on Electronics Technology (ISSE) - Assembly Problems in Lead-free and Mix Production

Sitek, Janusz, Drozd, Z., Bukat, K.

Year:

2007

Language:

english

File:

PDF, 1.00 MB

english, 2007

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